ESL737
| ESL737 | |
|---|---|
| plasma Based Materials processing | |
| Credits | 3 |
| Structure | 3-0-0 |
| Pre-requisites | |
| Overlaps | |
ESL737 : plasma Based Materials processing
[edit]Introduction: Plasma based processing of materials Plasma Concepts: Plasma fluid equations, single particle motions, unmagnetized plasma dynamics, diffusion and resistivity, the DC sheath and probe diagnostics. Basics of Plasma Chemistry: Chemical reactions and equilibrium, chemical kinetics, particle and energy balance in discharges. Low Pressure Plasma Discharges: DC discharges, RF discharges - Capacitively and inductively coupled, microwave, ECR and helicon discharges. Low Pressure Materials Processing Applications: Etching for VLSI, film deposition, surface modification and other applications (plasma Courses of Study 2024-2025 Energy Science and Engineering 202nitriding, plasma ion implantation, biomedical and tribological applications).High Pressure Plasmas: High pressure non-equilibrium plasmas, thermal plasmas – the plasma arc, the plasma as a heat source, the plasma as chemical catalyst.Applications of High Pressure Plasmas: Air pollution control, plasma pyrolysis and waste removal, plasma based metallurgy – ore enrichment, applications in ceramics, plasma assisted recycling.