MLL742: Difference between revisions
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| credit_structure = 3-0-0 | | credit_structure = 3-0-0 | ||
| pre_requisites = | | pre_requisites = | ||
| overlaps = MCL331 | | overlaps = [[MCL331]] | ||
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== MLL742 : Micro and Nano Fabrication in Materials Engineering == | == MLL742 : Micro and Nano Fabrication in Materials Engineering == | ||
Introduction to microfabrication, crystal growth and defect, diffusion and ion implantation, wafer preparation and specifications, thermal oxidation: Deal-Grove model of oxidation, rapid thermal annealing, pattern transfer by optical and ebeam lithography, photoresist, vacuum science and plasmas, etching, physical (DC and RF sputtering, ebeam evaporation) and chemical vapor deposition, stress measurement in thin film, silicon micromachining. | Introduction to microfabrication, crystal growth and defect, diffusion and ion implantation, wafer preparation and specifications, thermal oxidation: Deal-Grove model of oxidation, rapid thermal annealing, pattern transfer by optical and ebeam lithography, photoresist, vacuum science and plasmas, etching, physical (DC and RF sputtering, ebeam evaporation) and chemical vapor deposition, stress measurement in thin film, silicon micromachining. | ||
Latest revision as of 16:40, 14 April 2026
| MLL742 | |
|---|---|
| Micro and Nano Fabrication in Materials Engineering | |
| Credits | 3 |
| Structure | 3-0-0 |
| Pre-requisites | |
| Overlaps | MCL331 |
MLL742 : Micro and Nano Fabrication in Materials Engineering
Introduction to microfabrication, crystal growth and defect, diffusion and ion implantation, wafer preparation and specifications, thermal oxidation: Deal-Grove model of oxidation, rapid thermal annealing, pattern transfer by optical and ebeam lithography, photoresist, vacuum science and plasmas, etching, physical (DC and RF sputtering, ebeam evaporation) and chemical vapor deposition, stress measurement in thin film, silicon micromachining.